Yokohama, Kanagawa Ken 226-8503 Japan
Virtual Reality , Mixed Reality , Haptics , Dexterous Manipulation
Beijing Information Science & Technology University
B.S., Electronic Information Engineering
2016 - 2020
Tokyo Institute of Technology
M.S., Course of Information and Communications Engineering
2020 - 2022
Tokyo Institute of Technology
Ph.D., Course of Information and Communications Engineering
2022 - Present
Lightweight Fingernail Haptic Device: Unobstructed Fingerpad Force and Vibration Feedback for Enhanced Virtual Dexterous Manipulation Yunxiu Xu, Siyu Wang, Shoichi Hasegawa, IEEE Transactions on Haptics (Early Access), DOI: 10.1109/TOH.2025.3581014
2025
Lightweight Wearable Fingertip Haptic Device with Tangential Force Feedback based on Finger Nail Stimulation XU Yunxiu, Wang Siyu, Shoichi Hasegawa, The 32nd 2025 IEEE Conference on Virtual Reality and 3D User Interfaces, Saint-Malo, France, Booth ID: 1207
2025
Fingernail-Based Tangential Force Simulation for Enhanced Dexterous Manipulation in Virtual Reality XU Yunxiu, Shoichi Hasegawa, AsiaHaptics 2024, Sunway, Malaysia, pp.A3 (Best Demo Award)
2024
Optimizing Haptic Feedback in Virtual Reality: The Role of Vibration and Tangential Forces in Enhancing Grasp Response and Weight Perception XU Yunxiu, Wang Siyu, Shoichi Hasegawa, Eurohaptics Conference 2024, Lille, France
2024
Realistic Dexterous Manipulation of Virtual Objects with Physics-Based Haptic Rendering XU Yunxiu, Wang Siyu, Shoichi Hasegawa, ACM SIGGRAPH 2023 Emerging Technologies, Los Angeles, USA
2023
Physically-based Direct Object Manipulation by Hand and Fingertip Force Display in Fish Tank Virtual Reality XU Yunxiu, Wang Siyu, Shoichi Hasegawa, Tokyo, Asia Haptics 2022, Nov 2022.
2022
AsiaHaptics 2024 Best Demonstration Awards, Bronze,
2024
Representative for the National Scholarship for Undergraduate Students for the 2018-2019 Academic Year,
2020
RoboCup2019 Sydney, Middle Size League, Second place,
2019
Intel Cup Electronic design contest-2018 Embedded System Design Invitation Contest(Intel Cup), 2nd Prize,
2018
The 11th Undergraduate Physical Experiment Competition of Beijing, 1st Prize,
2018
CN211193905U
2019
CN110815237A
2019
CN112929651A
2021